BINDER to showcase latest innovations

October 2018 Major exhibition

Electronica: visit the BINDER booth!


BINDER GmbH will be making an appearance at the Electronica trade fair in the German city of Munich from November 13 through 16. With two dynamic climate chambers, a constant climate chamber, a drying and heating chamber with forced convection, and the new Multi Management Software APT-COM 4, the BINDER booth at Electronica offers a huge range of expertise spread across an area of 50 square meters. The APT-COM 4 in particular, which will be connected to a cell and module test chamber, is certainly not to be missed.


You can find us in hall A3 at booth 538. Our BINDER employees will take you on a journey into the future of simulation chambers and demonstrate the intricacies and special features of the equipment. And, as with any foray into the future, there will of course be plenty of fun to be had too! Play a quick round of golf at our BINDER booth to be in with a chance to win a fantastic prize.


You can also book a personal appointment with one of our booth team members today.


We look forward to seeing you there!