BINDER at trade fairs

October 2018 Focus on new products

BINDER looks forward to a fall filled with trade fairs

 

BINDER is in an optimistic mood. Many new products have already hit the market and others are about to be launched. The manufacturer of simulation chambers will present its extensive and new portfolio of products at trade fairs in the fall.

Anyone who intends to visit a major trade fair in the fall is bound to come across BINDER. At its base in Tuttlingen, the company is already planning its exhibits, which will be designed to give visitors a comprehensive look at its new products, including the CB 170.

 

Things continue in Europe – specifically in the Netherlands – with the WOTS trade fair from October 2 through 5. The new Solid.Line will be showcased at the stand, where your host will be sales representative Cor Koster. The trade fair in Utrecht is always worth a visit.

 

A little further afield, analytica China will be taking place. We will be represented at this event by our subsidiary in Shanghai. BINDER is very popular in Asia in particular, and we are ready for the rush.

The Electronica trade fair, which will take place from November 13 through 16 in Munich, is a major event for BINDER. BINDER's mood of optimism will be clear for all to see.

Alongside these trade fairs, BINDER will be making appearances at local events almost every week – you might even find us at one near you.

 

Would you like a personal appointment with us at Electronica 2018 in Munich?

We are excited to see you soon!